ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. The company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.
ChipMOS TECHNOLOGIES INC. (IMOS) - Company Outlook
Company Outlook
| Year | Receivables | Debt | Liabilities | Assets | Current Assets |
|---|---|---|---|---|---|
| 2023 | 5.76 B | 3.62 B | 21.31 B | 46.16 B | 25.16 B |
| 2022 | 6.86 B | 4.99 B | 20.3 B | 44.94 B | 20.31 B |
| 2021 | 6.83 B | 5.09 B | 18.14 B | 42.52 B | 16.49 B |
| 2020 | 5.81 B | 4.49 B | 14.36 B | 35.08 B | 12.36 B |
| 2019 | 4.45 B | 5.03 B | 14.65 B | 34.31 B | 11.76 B |