Lasertec Corporation develops, manufactures, sells, and services semiconductor-related equipment, laser microscopes, and flat panel display-related equipment worldwide. The company provides systems used to inspect and measure defects on semiconductor photomasks and wafers; wafer related systems, such as SiC, GaN, multi-wavelength, and wafer edge inspection and review systems; wafer bump inspection and measurement systems; and TSV back grinding process measurement systems. It also offers flat panel display photomask inspection systems; laser microscopes, which are used for the observation and measurement of various materials and components comprising semiconductor materials, transparent films, coating materials, inorganic and organic materials, biological samples, metal parts, and plastic components; and lithium-Ion batteries. The company was formerly known as NJS Corporation and changed its name to Lasertec Corporation in 1986. Lasertec Corporation was founded in 1960 and is headquartered in Yokohama, Japan.
Lasertec Corporation made a total of 23 dividend payments.
The sum of all dividends (adjusted for stock splits) is : $6.58
Date | Dividend | Adj Dividend |
---|---|---|
December 27, 24 | $0.74 | $0.74 |
June 27, 24 | $1.01 | $1.01 |
December 28, 23 | $0.47 | $0.47 |
June 29, 23 | $0.83 | $0.83 |
December 29, 22 | $0.34 | $0.34 |
June 29, 22 | $0.32 | $0.42 |
December 29, 21 | $0.21 | $0.21 |
June 29, 21 | $0.23 | $0.23 |
December 29, 20 | $0.13 | $0.13 |
June 29, 20 | $0.17 | $0.17 |
December 27, 19 | $0.20 | $0.10 |
June 26, 19 | $0.20 | $0.10 |
December 26, 18 | $0.10 | $0.05 |
June 27, 18 | $0.14 | $0.07 |
December 27, 17 | $0.08 | $0.04 |
June 28, 17 | $0.18 | $0.09 |
June 28, 16 | $0.33 | $0.08 |
June 26, 15 | $0.30 | $0.07 |
June 26, 14 | $0.17 | $0.04 |
June 26, 13 | $0.03 | $0.00 |
June 27, 12 | $0.03 | $0.00 |
June 28, 11 | $0.26 | $0.03 |
June 28, 10 | $0.10 | $0.01 |