ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. The company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.
According to ChipMOS TECHNOLOGIES INC.'s latest financial reports the company's current earnings (TTM) are $2.05 B. The earnings displayed on this page is the company's Pretax Income.
Year | Income Before Tax | Net Income |
---|---|---|
2023 | $2.05 B | $1.97 B |
2022 | $4.03 B | $3.44 B |
2021 | $6.04 B | $4.94 B |
2020 | $2.97 B | $2.38 B |
2019 | $3.03 B | $2.58 B |
2018 | $1.78 B | $1.1 B |
2017 | $1.52 B | $3.03 B |
2016 | $1.7 B | $1.71 B |
2015 | $2.86 B | $2.23 B |
2014 | $4.79 B | $3.32 B |
2013 | $3.35 B | $2.32 B |
2012 | $1.33 B | $1.12 B |
2011 | $218.09 M | $361.89 M |